Diamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared SubstratesDiamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared SubstratesDiamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared Substrates
Diamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared SubstratesDiamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared SubstratesDiamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared Substrates

Diamond Turning Tool for Infrared Materials, Single Crystal Diamond Cutting Tool for Infrared Substrates

Optimized for germanium (Ge), silicon (Si), zinc selenide (ZnSe), and chalcogenide glass workpieces.

Specification

Applications & Material-Specific Advantages
 
Optimized Geometry for Infrared Materials  
Specialized Tool Geometry: -25° rake angle with R0.1-2.0mm edge radius for brittle IR materials (Ge/Si/ZnSe/chalcogenide glass).  
Benefit: Prevents micro-chipping and subsurface damage in delicate optical crystals.  
 
Superior Surface Finishing Capability 
Mirror-Grade Results: Defect-free cutting edges replicate ultra-smooth surfaces (Ra ≤ 0.01μm).  
IR Application Impact: Eliminates post-polishing for infrared lenses, windows, and sensors.  
 
Non-Ferrous Metal Machining Precision  
Dedicated Configuration: 0° rake angle with R0.1-1.5mm for aluminum/copper components in IR assemblies.  
Application Example: High-Accuracy Machining of Cooling Housings and Structural Parts.  
 
 
Technical Superiority: Why Our Monocrystalline Tools Excel
 
Extreme Hardness (90-100 GPa) 
- Industry-leading wear resistance → 5- 8x longer lifespan vs. PCD tools in Si/Ge machining.  
 
Zero Edge Defects 
- Atomic-level edge integrity → Eliminates surface striations on IR optics.  
 
Anti-Adhesion Surface  
- Low chemical affinity with IR materials → Prevents built-up edge (BUE) and material transfer.  
 
Nanometric Edge Stability  
- Sustained sharpness under high-temperature cutting → Critical for ZnSe’s low melting point.  
 

 

- Edge Radius: R0.1mm to R10.0mm (laser-confirmed tolerance ±0.02mm)  

- Rake Angle: -45° to 0° (material-specific optimization)  
- Clearance Angle: 10°-15° (prevents workpiece rubbing)  
- Included Angle: 30°-60° (balance strength vs. penetration) 

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