Wafer cutting blade finishing solutions for the semiconductor industry

02 November 2022
The wafer is the basic raw material for the production and manufacture of semiconductor devices, extremely pure semiconductor materials through the process of pulling, slicing, and other processes to make wafers, wafers through a series of semiconductor manufacturing production processes to produce tiny control circuit structure, and then through cutting, packaging, testing into chips, widely used in a variety of electronic instruments.
Wafer chamfer and the round edge is usually curved cutting or inner wafer cutting saw blade, cut wafer blade its outer edge is particularly sharp, to prevent corner rupture from affecting wafer hardness, or damaging the surface smoothness and bringing environmental pollution to the post-process, it is necessary to use special CNC equipment to automatically correct the wafer edge, shape, and outer diameter size, so the cutting knife directly affects the quality of the finished product.


Wafer Cutting Tools

The production of wafer-cutting blades is first roughed by carbide tools, then semi-finished by PCD inserts, and finally finished with MCD turning tools to achieve extremely high dimensional accuracy and surface finish.


Single Crystal (MCD) turning tool finishes the surface and inner hole of the wafer cutting blade, and the cutting performance is more stable, which improves the cutting quality and cutting accuracy of the cutting blade-encapsulated rear substrate, and greatly increases the production capacity, tailored to meet the needs of users to meet their process and project needs.
Wafer cutting
Single crystal tools have many advantages in ultra-precision machining, and high hardness and wear resistance can avoid the influence of tip wear on the workpiece size to the greatest extent during ultra-precision machining.
In addition, good thermal conductivity and a low coefficient of thermal expansion make it possible not to produce large thermal deformations during machining.
And the edge roughness of the single crystal tool is small, the edge is very sharp, up to Ra0.01-0.006μm, and the single crystal cutting allowance is less than 0.02mm.
Single crystal processing materials and applicable industries are as follows:
Metal materials: aluminum alloy, aluminum, brass, copper, gold, nickel, silver, tin, zinc, HRC50 hard steel, etc.;
Polymer materials: acrylic resin, nylon, polypropylene, polystyrene, silicone, etc.;
Infrared crystal materials: calcium fluoride, gallium arsenide, germanium, magnesium fluoride, silicon, zinc selenide, zinc sulfide, etc.
Military industry: off-axis triple-mirror mirror, missile fairing, precision infrared optical system, etc.;
Civil: spherical and aspheric freeform lenses, Fresnel lenses, high-precision mold cores, ultra-bright ultra-uniform light guide plates, compound eye structures, etc.
Single crystal diamond tools
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